Product Description
Microporous board is made with special technology using various raw materials, the thermal conductivity is lower than stationary air under atmospheric pressure, only 1/4 to 1/10 than ceramic fiber insulation material, it is the best lowest thermal conductivity solid material. In some high temp equipment which requiring space and weight, microporous board is the best, sometimes the only option. The birth of this materials has promoted related high temp equipment designing innovation.Typical Features
Super low thermal conductivity and thermal loss Low heat storage Excellent thermal stability Environment friendly Easy cutting and processing Long service lifeTypical Application
Iron & Steel ( Tundish, ladel, torpedo ladel) Petrochemical (Pyrolyzer, Hydrogen Transform Furnace, reformer furnace, heating furnace) Glass (Float glass furnace, glass tempering furnace, bending furnace) Heat treatment: electric furnace, car-heater, Annealing furnace, tempering furnace etc. Pipe insulation Ceramic industry Power Generation Domestic appliance Aerospace Shipping mine rescue capsuleTypical product properties
| Microporous Board Typical Product Properties | ||
| Product Name | Microporous Board | |
| Product Code | MYNMB-1000 | |
| Microporous Rate | 90% | |
| Permanent Linear Shrinkage(800℃，12h) | ＜3% | |
| Nominal Density(kg/m3) | 280kg/m3±10% | |
| Thermal Conductivity(W/m·k) | 200℃ | ＜0.022 |
| 400℃ | ＜0.025 | |
| 600℃ | ＜0.028 | |
| 800℃ | ＜0.034 | |
| Availability: Thickness: 5mm~50mm | ||
| Note: Test data shown are average results of tests conducted under standard procedures and are subject to variation. Results should not be used for specification purposes. The products listed comply to ASTM C892. | ||